Microwaves & RF

How Integrated RF Transceivers Enhance DAS or Repeater Indoor Connectivity

The need for reliable and seamless connectivity in large indoor spaces and densely populated areas has fueled technological ...
조선일보

Samsung Electro-Mechanics and LG Innotek diversify into AI parts, boost profits and restructure

One of Samsung Electro-Mechanics’ new growth engines, the next-generation semiconductor substrate business FC-BGA (flip-chip ball grid array), is also gaining ... year and apply a self-developed ...
IEEE

HuIV-GAN: A Human-in-the-Loop VAE-GAN for Industrial Image Synthesis in Class-Imbalanced Ball Grid Array Object Detection

Abstract: In industrial inspection, severe class imbalance poses a major challenge for training accurate detection models. Generative methods offer a potential solution by augmenting minority-class ...
IEEE

Mechanical Properties analysis of Indium-Silver Alloys Thermal Interface Materials for FCBGA Reliability

Abstract: This study used mechanical properties to compare whether pure indium and indium-silver alloys with different silver contents as thermal interface materials (TIM) for flip-chip ball grid ...