Machine learning workflow enables faster, more reliable organic crystal structure prediction

Prediction of crystal structures of organic molecules is a critical task in many industries, especially in pharmaceuticals ...
IEEE

Determination of solder bump stand-off height in a flip-chip sub-mount for Micro-Opto-Electro-Mechanical System (MOEMS) packaging applications

Abstract: Solder is a very common and important material for electronic packaging. The major function of the solder is to provide the electrical connection between different electrical components. In ...
IEEE

Research on the Optimization Method of SMT Process Parameters Based on Improved PSO Algorithm

Abstract: Surface mount technology (SMT) is pivotal in electronic manufacturing, with 60%–70% of quality issues linked to solder paste printing (SPP). This article presents a real-time optimization ...