One of Samsung Electro-Mechanics’ new growth engines, the next-generation semiconductor substrate business FC-BGA (flip-chip ball grid array), is also gaining ... year and apply a self-developed ...
Abstract: For random dynamic loads such as cyclic shock and vibration of semiconductor modules, a method using field load assessment and fatigue life estimation is proposed in order to improve the ...
Abstract: Despite their significant potential for high-power applications, GaN-on-sapphire HEMTs face critical thermal management challenges due to the inherently low thermal conductivity of sapphire ...
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